Production Process Engineer

Job Title: Production Process Engineer

Location: New Hampshire

Salary: $150 – $175k

The Production Process Engineer is responsible for the back-end packaging process from die bond through final packaging (e.g., TO-Cans, 14-Pin Butterflies, Photonic Integrated Circuits), reliability improvement, and support of failure analysis for next-generation GaN-based UV/VIS laser technology. This technology serves multiple markets, including industrial, microelectronics, defense, scientific, and biotech. The ideal candidate will have experience in eutectic bonding and laser diode packaging, as well as a proven ability to solve complex technical problems, particularly within commercial and defense industries. Candidates should demonstrate expertise in analytical problem-solving, familiarity with laser diode multi-cell reliability modeling (e.g., FIT models, HAST, and HALT testing), and hands-on experience with various optoelectronic packaging technologies, including FP, DFB, DBR, or VCSEL semiconductor laser diodes.

Objective:

The role involves overseeing all aspects of bonding, opto-mechanical packaging, modeling, and reporting for next-generation GaN diode lasers. The position will also contribute to reliability and failure analysis concepts during new product development, qualification, and ongoing production.

Principal Areas/Functions:

75% Bonding and Packaging Process Development and Failure Analysis:

• Develop and maintain die bonding efforts, establishing statistical process control, and driving continuous yield and performance improvement.
• Develop and maintain CoS bonding processes, identifying and implementing hierarchical soldering solutions.
• Oversee FAC and SAC lens placement and fiber coupling efforts.
• Support failure analysis processes to determine root causes using internal resources or external vendors.
• Provide feedback for device design evolution.
• Support efforts to establish burn-in criteria, HAST, HALT qualification processes, and multi-cell reliability protocols to support product development, qualification, and production screening.
• Analyze laser device performance throughout package development and reliability testing, applying materials and physics knowledge to correlate performance drifts with design and process inputs.
• Collaborate with device design engineers and technical program managers on new products from concept through manufacturing release.
• Work with the reliability and failure analysis teams to develop, execute, and improve qualification plans with internal infrastructure and external contract manufacturers.
• Collaborate with test engineers and technicians to conduct functional testing, including laser current-power-voltage measurements, spectra/junction temperature measurements, near- and far-field measurements, etc.
• Participate in qualification reporting through email updates, customer presentations, internal reviews, and documented reports.
• Define key technical objectives and manage projects through various development phases (feasibility, alpha, beta) and into production to meet program milestones and product reliability requirements.
• Collaborate with testing and reliability groups to design and set up new test systems to measure laser diode performance.

25% Technical Program Interaction:

• Stay current with state-of-the-art principles to advance packaging-related performance of laser diodes.
• Monitor laser diode performance during development and production.
• Establish, monitor, analyze, and report key performance metrics to project teams and management.
• Participate in the development of patent applications.
• Collaborate to publish and present results at industry events and trade shows.
• Engage in program reporting, proposal writing, and program management for commercial and government programs.

Background/Skills:

• Bachelor’s degree in mechanical or electrical engineering, physics, or materials science with 8+ years of experience, or a Master’s degree with 3+ years of experience in a laser diode packaging environment.
• Experience with Gallium Nitride (GaN) materials systems, including packaging design/modeling, epitaxy, fabrication, or testing, is highly desirable.
• Expertise in the development and execution of package design and implementation strategies.
• Demonstrated leadership ability and capacity to direct and influence across multiple functional departments; strong team player.
• Hands-on experience with bonding and package assembly processes, particularly for laser diodes, including hermetic testing.
• Experience with reliability stress testing, such as accelerated temperature, high humidity, temperature, and power cycling, ESD is a plus.
• Proficiency in deep statistical analysis of large datasets.
• Experience with software data analysis tools (e.g., JMP, Minitab, Excel) and data processing software (e.g., Python, MATLAB).
• Knowledge of semiconductor device physics and/or reliability engineering is a plus.
• Strong organizational and decision-making skills.
• Excellent communication skills, both oral and written.

Additional Information:

The position is based at a facility in New Hampshire. Remote work is possible, but on-site work will be required most of the time. This position must meet Export Control compliance requirements, and therefore, a “US Person” as defined by 22C.F.R. §120.15 is required. “US Person” includes US citizens, lawful permanent residents, refugees, and asylees.